Silicon Wafer Dicing Machine
BLACKSTAR™ is a laser wafer dicing machine. This system utilizing our patented Fantom-Width Laser Dicing Technology® (FWLDT®) invented and patented by Laser Photonics and modified to accommodate the requirements of a silicon wafer singulation process without affecting the existent dicing method, processes, or procedures. The FWLDT® splits materials at the molecular level at tremendous speed with no material loss. This results in the highest edge quality and the fastest dicing speed.
Wafers have the highest value at the dicing stage and the primary focus of a BlackStar™ is to increase the number of dies, yield per wafer, and to maximize throughput while minimizing the HAZ specifically for “power-hungry” RF microdevices and low-K wafer substrates.
The system is applicable for the dicing of assorted semiconductor materials such as silicon (Si), gallium arsenide (GaAs), germanium (Ge), indium phosphide (InP), silicon carbide (SiC), gallium nitride (GaN), gallium phosphide (GaP), other compound materials, as well as low-k and multi-layer composite materials.
Advantages of Zero-Width Dicing Technology:
The possibility of a cut with zero or 20-micron narrow width (application-specific) allows wafer layout designers to reduce the width of the spacing between adjacent die on a wafer. The spacing is normally reserved to allow for the width of the saw used to cut the wafer. A reduction of the spacing width will result in an increase of the real estate available for die, which will result in a significant reduction of the cost. View more systems for the Semiconductor & Electronics Industry
Benefits Extended to Our Customers
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Features & Specifications
|Wafer Thickness||50µ to 700µ|
|Wafer Size||12 inches (maximum)|
|Frame||Standard (8″ – 12″)|
|Vision System||Two-level magnification with optical zoom|
|Clean Room Compatibility||Class 1000 or 10000|