Zero Width Laser Cutting TechnologyTM

The GW500AB is the latest generation of precision ZWLCTTM laser Glass Wafer Dicing system for IR and CF camera windows, micro displays and other demanding applications.

Parameter Value
Dicing Speed 1000 mm/sec
Glass Wafer Dicing Time 3.5 min.
Surface Area Loss 0% loss
Street Width 0
HAZ 0
Surface Temperature 100° C
# of Passes Required 1
Micro Cracks none
Chipping none
Edge Strength excellent, 5 times stronger then conventional scribe and brake
Glass Wafer Thickness 0.3 to 0.5 mm
Residue none
After-Process Cleaning Requirements none
Clean Room Compatibility Class 1000 or  10000

LASER

  • Type Fantom™ sealed CO2 Laser
  • Allowing modular replacement

WAFER

  • Material: Glass 0.3 -0.5 mm thick.
  • Wafer size – 12″ max.
  • Frame: Standard types (5”, 6”, 8” or 12″)
  • Holding tape: standard low tack

VISION SYSTEM

  • Two-level Magnification
  • Optical zoom
  • Type: Pattern Recognition with
  • Automatic alignment

MOTION SYSTEM

  • 4 axis direct drive servo platform.
  • Working area 800 x 800 mm
  • Maximum axis speed 2000 mm/s

BREAKING SYSTEM

  • Integrated with the scribing head
  • Breaking capability – 300 x 300 mm max