System Description:

Zero Width Laser Cutting TechnologyTM

The GW500AB is the latest generation of precision ZWLCTTM laser Glass Wafer Dicing system for IR and CF camera windows, micro displays and other demanding applications.

  We Offer Our Customers…
  • Factory and on-site operator training
  • Advanced customer training
  • Designated customer service engineers
  • Optimal system configuration
  • Inbound Customer Support
  • Advanced application support
  • Notifications of System Upgrades
  • Remote diagnostics capability
  • Direct Technical Support
  • Engineers log in for testing/troubleshooting

Higher speed

  • 100 times faster than conventional laser dicing
  • 20 times faster than mechanical saw

High throughput

  • Can process 200mm glass wafer in under 2 minute
    Increase yield
  • Save on space, time, labor and machine expense

High precision and accuracy

  • No loss of material
PARAMETER VALUE
Dicing Speed 1000 mm/sec
Glass Wafer Dicing Time 3.5 min.
Surface Area Loss 0% loss
Street Width 0
HAZ 0
Surface Temperature 100° C
# of Passes Required 1
Micro Cracks none
Chipping none
Edge Strength excellent, 5 times stronger then conventional scribe and brake
Glass Wafer Thickness 0.3 to 0.5 mm
Residue none
After-Process Cleaning Requirements none
Clean Room Compatibility Class 1000 or  10000
  • Single or Dual Head Configuration
  • Optional Dual Head master-slave configuration
  • 2 units of Fiber Lasers configured for Dual head operation
  • 3D package for focal distance alignment without mechanical Z-axis
  • Master/ Slave configuration or both heads works independently from each other
  • Damage-free dicing
  • Capable of producing smallest street widths which in return provides additional space for more parts per wafer
  • High speed (up to 1m/sec) process results in reduction of cost and processing time per wafer
  • Capable of cutting wafers on tape frame
  • All-in-one system

LASER

  • Type Fantom™ sealed CO2 Laser
  • Allowing modular replacement

WAFER

  • Material: Glass 0.3 -0.5 mm thick.
  • Wafer size – 12″ max.
  • Frame: Standard types (5”, 6”, 8” or 12″)
  • Holding tape: standard low tack

VISION SYSTEM

  • Two-level Magnification
  • Optical zoom
  • Type: Pattern Recognition with
  • Automatic alignment

MOTION SYSTEM

  • 4 axis direct drive servo platform.
  • Working area 800 x 800 mm
  • Maximum axis speed 2000 mm/s

BREAKING SYSTEM

  • Integrated with the scribing head
  • Breaking capability – 300 x 300 mm max

Interested In Financing Options?