Glass Wafer Dicing
Zero Width Laser Cutting TechnologyTM
The GW500AB is the latest generation of precision ZWLCTTM laser Glass Wafer Dicing system for IR and CF camera windows, micro displays and other demanding applications.
Safe
Cost-Effective
Easy To Use
Higher speed
- 100 times faster than conventional laser dicing
- 20 times faster than mechanical saw
High throughput
- Can process 200mm glass wafer in under 2 minute
Increase yield - Save on space, time, labor and machine expense
High precision and accuracy
- No loss of material
Technical Specifications
Specifications
| Dicing Speed | 1000 mm/sec |
| Glass Wafer Dicing Time | 3.5 min. |
| Surface Area Loss | 0% loss |
| Street Width | 0 |
| HAZ | 0 |
| Surface Temperature | 100° C |
| # of Passes Required | 1 |
| Micro Cracks | none |
| Chipping | none |
| Edge Strength | excellent, 5 times stronger then conventional scribe and brake |
| Glass Wafer Thickness | 0.3 to 0.5 mm |
| Residue | none |
| After-Process Cleaning Requirements | none |
| Clean Room Compatibility | Class 1000 or 10000 |
Options
- Single or Dual Head Configuration
- Optional Dual Head master-slave configuration
- 2 units of Fiber Lasers configured for Dual head operation
- 3D package for focal distance alignment without mechanical Z-axis
- Master/ Slave configuration or both heads works independently from each other
Benefits
- Damage-free dicing
- Capable of producing smallest street widths which in return provides additional space for more parts per wafer
- High speed (up to 1m/sec) process results in reduction of cost and processing time per wafer
- Capable of cutting wafers on tape frame
- All-in-one system